Rogers Corporation to Introduce New Product and Showcase High Frequency Laminates at 2009 International Microwave Symposium
Release Date: 05/06/2009
Return to List
Chandler, AZ, May 6, 2009 - Rogers Corporation (NYSE:ROG), a leading supplier of high frequency laminates, will announce the launch of another new member to its family of advanced circuit materials at the 2009 International Microwave Symposium (IEEE MTT-S) to be held at the Boston Convention & Exhibition Center June 9th-11th (Booth # 1018.)
The Advanced Circuit Materials Division will also be showcasing recently introduced materials especially targeted to meet next generation material requirements for the microwave industry:
RO4000® LoPro™ Laminates
RO4000 LoPro laminates implement a special interface technology to enable the use of a very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. RO4000 LoPro laminates combine the best-in-class electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and outstanding passive intermodulation (PIM) characteristics.
RT/duroid® 5880LZ Laminates
The award winning RT/duroid 5880LZ material is a PTFE composite designed for exacting stripline and microstrip circuit applications. This groundbreaking filler system results in a low density (1.37 gm/cm3), lightweight material, making it an ideal choice for high performance weight sensitive applications such as airborne antennas. RT/duroid 5880LZ laminate has a dielectric constant (Dk) of 1.96 @ 10 GHz, providing the lowest Dk of a copper clad microwave material available today. In addition, the dielectric constant is uniform from panel-to-panel and constant over a wide frequency range, with a low z-axis TCDk of +22 ppm/°C. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ to Ku-band and above.
In addition, the following well known commercial grade materials for high performance applications will be on display:
- RO3000® Laminates: Features low dielectric loss for high frequency applications; uniform mechanical properties, ideal for multilayer boards; as well as stable Dk versus frequency and temperature.
- R/flex® 8080 Photoimageable Covercoat Materials: Designed to provide uniform coverage in mass production applications, Rogers R/flex 8080 enables printed circuit board manufacturers to achieve ultra-fine, high precision etch patterns that have traditionally been unattainable through conventional screen printing. The photoimageable covercoat materials provide outstanding imaging resolution, flexibility and creaseability, required for developing today’s high-density flexible printed circuits.
About Rogers Corporation
Rogers Corporation (NYSE:ROG), headquartered in Rogers, Conn., is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, and Illinois), Europe (Ghent, Belgium) and Asia (Suzhou, China). In Asia the company maintains sales offices in Japan, China, Taiwan, Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics and in the U.S. with Mitsui Chemicals. The world runs better with Rogers.® http://www.rogerscorp.com.
The Rogers’ logo, R/flex, RT/duroid, RO4000, RO3000, LoPro and The world runs better with Rogers. are licensed trademarks of Rogers Corporation.