Rogers Corporation to Showcase High Frequency Laminates at Satellite 2009
Release Date: 03/11/2009
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Chandler, AZ, March 11, 2009 - Rogers Corporation (NYSE:ROG), a leading supplier of high frequency laminates for decades, will feature several high performance solutions from its family of advanced circuit materials at the 2009 Satellite show, in Washington D.C., March 25-27th (Booth #269)
Rogers Corporation, Advanced Circuit Materials Division, is excited to announce the launch of two new materials especially targeted to meet next generation material requirements for the aerospace and defense industry:
RT/duroid® 5880LZ Laminates
PTFE composites designed for exacting stripline and microstrip circuit applications. Our ground-breaking filler system results in a low density (1.37 gm/cm3), lightweight material for high performance weight sensitive applications. The 1.96 dielectric constant of RT/duroid 5880LZ laminates is among the lowest available for any microwave PCB material. In addition, the dielectric constant is uniform from panel to panel and constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ to Ku-band and above.
RT/duroid 6202PR High Frequency Materials
RT/duroid 6202PR high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are electrically stable and used for planar resistor applications. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This enables the manufacture of very tight tolerance planar resistors.
In addition, the following well known laminates for high performance satellite applications will be on display:
• RT/duroid 5000: Features the lowest electrical loss for reinforced PTFE; uniform electrical properties over frequency; and excellent chemical resistance.
• RT/duroid 6000: Features electrical properties; tight DK, thickness control; extremely low TCDK; and low out-gassing, ideal for space applications.
• RO3000® High Frequency Laminates: Features low dielectric loss for high frequency applications; uniform mechanical properties, ideal for multi layer board; as well as stable DK versus frequency and temperature.
• TMM® material: Features exceptionally low TCDK; a wide range of DK values; and thermoset resin for wire bonding.
• RO4000®: Features excellent electrical properties with low DK tolerance and loss; the best overall value for high frequency applications; low thermal coefficient of expansion (CTE) and excellent dimensional stability.
The Rogers’ logo, RT/duroid, RO4000, RO3000, TMM, ULTRALAM and The world runs better with Rogers. are licensed trademarks of Rogers Corporation.
About Rogers Corporation
Rogers Corporation (NYSE:ROG), headquartered in Rogers, Conn., is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, and Illinois), Europe (Ghent, Belgium) and Asia (Suzhou, China). In Asia the company maintains sales offices in Japan, China, Taiwan, Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics and in the U.S. with Mitsui Chemicals. The world runs better with Rogers. ® www.rogerscorp.com.