Rogers to Feature Advanced Circuit Materials at IMAPS Conference and Exhibition on Device Packaging 2009
Release Date: 02/23/2009
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Chandler, AZ, February 23, 2009 - Rogers Corporation’s Advanced Circuit Materials Division (ACMD) will be exhibiting RO4000®, RO2808™ and ULTRALAM® 3000 advanced high performance laminates at the upcoming IMAPS Device Packaging show to be held at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona USA on March 10th and 11th (Rogers booth #12).
RO4000, RO2808 and ULTRALAM 3000 laminates provide proven solutions for a wide range of applications such as high performance chip carrier substrate, high speed network transport gear and high speed data transmission used in high speed computing, telecommunications and wireless.
Design engineers will be particularly interested in the recently launched RO2808 high frequency material. A ceramic-filled PTFE material with a dielectric constant of 7.6, RO2808 material offers the stability and high frequency performance of LTCC. RO2808 material boasts a low loss tangent of 0.002 or less, and can be supplied as 1-mil thick boards to support low profile designs. It also features high moisture resistance, high reliability and excellent high frequency performance.
RO4000 laminate is widely used in the power amplifier market, with outstanding electrical and mechanical properties. A low loss material, RO4000 laminate exhibits low z-axis expansion, making it an ideal choice for high frequency applications in which plated through-hole reliability is important.
Rogers’ ULTRALAM 3000 Series LCP circuit material is a thin double-clad copper laminate, characterized by low and stable dielectric constant (2.9) and dielectric loss. It has very low moisture absorption (< 0.04 percent by weight). ULTRALAM 3000 Series laminates are used for high frequency microminiaturization applications, sensors, antennas and high-speed flip-chip designs. ULTRALAM 3000 can be used with ULTRALAM 3908 bonding film for multilayer constructions.
About Rogers Corporation
Rogers Corporation (NYSE:ROG), headquartered in Rogers, Conn., is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, and Illinois), Europe (Ghent, Belgium) and Asia (Suzhou, China). In Asia the company maintains sales offices in Japan, China, Taiwan, Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics and in the U.S. with Mitsui Chemicals. The world runs better with Rogers. ® www.rogerscorp.com.
The Rogers’ logo, RT/duroid, RO4000, RO3000, TMM, ULTRALAM, RO2808 and The world runs better with Rogers. are licensed trademarks of Rogers Corporation.