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主页 >> 先进线路板材料 >> 产品 >> 罗杰斯高频层压板 >> RO2808™含氟化合物复合电路板材料，适用于高级封装应用。
RO2808™电路板材料是含氟化合物复合材料的印刷电路板，专门为高级封装应用而设计。RO2808™产品兼具高介电常数和薄型介质的特性，拥有卓越的电气性能 - 单位面积电容量高，可以显著提升元器件的集成度并且缩减封装模组引脚面积。
The low dissipation factor, along with the low profile copper thickness option, offers low electrical loss and high Q factor for signal propagation, and narrow line width and spacing in high I/O count configurations. In addition, the ceramic filler system improves the circuit laminate’s dimensional stability, surface finish, and laser processing compared with woven glass reinforced products. A low modulus and X,Y-directions coefficient of thermal expansion afford reliable surface mounting of high I/O leadless ceramic chip carriers.
Contact us for product sampling. Consult your Rogers' Technical Service Engineer for fabrication guidelines.