主页
市场
航空和防卫
新能源
汽车
通信基础设施
鞋类和运动、休闲类
卫生保健
高速数据
工业制造业
公共交通
手机和消费电子产品
电源分配系统
印刷
半导体
标识系统
专业照明
产品
电路原料
LONGLITE™ 和 R/flex® 柔软电路材料 -薄介质板
RO3000®系列层压板
RO4000®系列层压板
RO4400™ 系列半固化片
RT/duroid® 层压板
SYRON™ laminates
Theta™ 电路板材料
TMM® 层压板
ULTRALAM® 2000层压板
ULTRALAM 3000 层压板
XT/duroid™ laminates
减震和包装
PORON® 聚氨酯泡沫
BISCO® 硅胶
罗杰斯印刷产品 - 水辊套
R/bak® 柔板印刷衬垫
电源分配系统
RO-LINX® 母线排
热管理解决方案
COOLSPAN™ 热介面材料
HEATWAVE™ 金属基复合材料
其他高性能材料
DUREL® 冷光发光灯
DUREL® 集成电路驱动器
ENDUR® 文件处理辊
NITROPHYL® 浮体
无纺布材料
业务部门
电路原料
Durel电子与发光管解决方案
弹性体部件
减震和包装
多层层压母线
热处理材料
新闻&活动
最近的新闻
展会和活动
投资者关系
分析家报道
年度及10K报告
声音文件
新闻稿
信息要求
总说明
邮件分配表
总裁信息
季刊报道
财务报表
社团管理
投资者关系主页
就业
美国
求职
学生中心
为什么罗杰斯
欧洲
在欧洲的职业
亚洲
亚洲职位
关于我们
联系我们
位置/地点
联系我们
合资企业
总说明
战略投资集团
导航
环境
环境,健康与安全
文档
我们的政策
管理系统
产品线
柔性电路材料-薄介质
高频层压板
先进电路材料
联系我们
新闻
关于我们
资料
文献
软件下载
技术尖端
FAQ
安全数据
行业链接
展会信息
ACM之家
订购信息
订购信息
Rogers快递计划
订购状况入口
大学计划
Market Solutions
汽车
航空和防卫
通信基础设施
半导体
高速数据
手机和消费电子产品
主页
>>
先进电路材料
>> 文献
文献
Articles
文件大小
Considerations When Choosing High Frequency Laminates
By John Coonrod, Rogers Corporation
August 2010
Featured in CircuiTree Magazine
English
546 KB
New High Frequency PCB Materials for the Power Amplifier Industry
by John Coonrod, Rogers Corporation
May 2010
Featured in May 2010 issue of Microwave Journal
English
1 MB
Properties of Low Dielectric Constant Laminates
By John Coonrod, Rogers Corporation
March 2010
Featured in ACI Technologies Inc, Monthly Newsletter (empfasis , March 2010)
English
843 KB
Effect of conductor profile on the insertion loss, phase constant, and dispersion in thin high frequency transmission lines
February 2010
Presented at DesignCon 2010
Written By: Allen F. Horn III, Rogers Corporation, John W. Reynolds, Rogers Corporation, Patricia A. LaFrance, Rogers Corporation, James C. Rautio, Sonnet Software
English
860 KB
Analyzing Advances in Antenna Materials
By Art Aguayo, Rogers Corporation
December 2009 / January 2010
Featured in December 2009 / January 2010 issue of Antenna Systems and Technology
English
3 MB
Advances in High Frequency Printed Circuit Board Materials
by Art Aguayo, Rogers Corporation
December 2009
Featured in December 2009 issue of Microwave Engineering Europe
English
2 MB
Microwave Materials Lay Foundation for PAs
By John Coonrod, Market Development Engineer, Rogers Corporation
December 2009
Featured in December 2009 issue of Microwaves and RF
English
1 MB
Low Density Laminate Overcomes PTFE Limitations
By Rogers Corporation
October 2009
Featured in October 2009 issue of Microwave Journal magazine
English
583 KB
Rogers Corp Executive Interview - Jim Carroll, Director of Marketing
October 2009
Featured in October 2009 issue of Microwave Journal
English
96 KB
Thin Printed Circuit Board Laminates in High Frequency Applications
by John Coonrod and Art Aguayo, Rogers Corporation
August 2009
Featured in August 2009 issue of CircuiTree magazine
English
680 KB
Advances in High Frequency Materials
By Art Aguayo, Rogers Corporation
June 2009
Featured in June 2009 issue of Microwave Engineering Europe
English
651 KB
An Overview of Material Options Suitable for Today's Commercial Millimeter Wave Designs
By Scott Kennedy, Al Horn, and Greg Bull
With Fuhan Liu, Hunter Chan, Venky Sundaram, and Rao Tummala (Georgia Tech)
May 2009
Featured in May 2009 issue of CircuiTree magazine
English
431 KB
High Frequency Circuit Materials Attributes
by John Coonrod, Rogers Corporation
English
430 KB
New Developments in High Frequency Printed Circuit Board
By John Coonrod, Market Development Engineer, Rogers Corporation
March 2009
Featured in March 2009 issue of Microwave Product Digest
English
2 MB