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	Effect of conductor profile on the insertion loss, phase constant, and dispersion in thin high frequency transmission lines February 2010 Presented at DesignCon 2010 Written By: Allen F. Horn III, Rogers Corporation, John W. Reynolds, Rogers Corporation, Patricia A. LaFrance, Rogers Corporation, James C. Rautio, Sonnet Software	English	860 KB
	Advances in High Frequency Printed Circuit Board Materials by Art Aguayo, Rogers Corporation December 2009 Featured in December 2009 issue of Microwave Engineering Europe	English	2 MB
	Microwave Materials Lay Foundation for PAs By John Coonrod, Market Development Engineer, Rogers Corporation December 2009 Featured in December 2009 issue of Microwaves and RF	English	1 MB
	Low Density Laminate Overcomes PTFE Limitations By Rogers Corporation October 2009 Featured in October 2009 issue of Microwave Journal magazine	English	583 KB
	Rogers Corp Executive Interview - Jim Carroll, Director of Marketing October 2009 Featured in October 2009 issue of Microwave Journal	English	96 KB
	Thin Printed Circuit Board Laminates in High Frequency Applications by John Coonrod and Art Aguayo, Rogers Corporation August 2009 Featured in August 2009 issue of CircuiTree magazine	English	680 KB
	Advances in High Frequency Materials By Art Aguayo, Rogers Corporation June 2009 Featured in June 2009 issue of Microwave Engineering Europe	English	651 KB
	An Overview of Material Options Suitable for Today's Commercial Millimeter Wave Designs By Scott Kennedy, Al Horn, and Greg Bull With Fuhan Liu, Hunter Chan, Venky Sundaram, and Rao Tummala (Georgia Tech) May 2009 Featured in May 2009 issue of CircuiTree magazine	English	431 KB
	High Frequency Circuit Materials Attributes by John Coonrod, Rogers Corporation	English	430 KB
	New Developments in High Frequency Printed Circuit Board By John Coonrod, Market Development Engineer, Rogers Corporation March 2009 Featured in March 2009 issue of Microwave Product Digest	English	2 MB

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